114. 16 ELEMENT 110 GHZ PHASED ARRAY TANSMITTER WITH WAFER-SCALE INTEGRATION

Department: Electrical & Computer Engineering
Research Institute Affiliation: Center for Wireless Communications (CWC)
Faculty Advisor(s): Gabriel Rebeiz

Primary Student
Name: Woorim Shin
Email: woshin@ucsd.edu
Phone: 858-822-5940
Grad Year: 2012

Abstract
This poster presents a two dimensional 16-element (4x4) phased array transmitter with wafer-scale integration. In this work, the antennas are built on a quartz superstrate which is directly attached on top of the silicon phased-array chip. This technology removes the necessity of wire-bonding and the lossy redistribution layer which are often problematic at mm-wave frequencies, thus resulting in efficient power combining and a much lower packaging cost. More importantly, this method is scalable to a large number of elements, and has the potential to scale up to wafers-scale sizes (4", 6", 8"). The measured radiation patterns show beam scanning to -/+ 30 deg in both the E- and H- planes, with a maximum EIRP of 18 dBm at 110 GHz. To our knowledge, this is the first demonstration of a wafer-scale phased array at any frequency. Possible applications include Gbps communication systems, active/passive imaging systems, and low cost radar sensors.

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