129. high heat flux boiling heat transfer through nanoporous membranes

Department: Mechanical & Aerospace Engineering
Faculty Advisor(s): Renkun Chen

Primary Student
Name: Qingyang Wang
Email: qiw093@ucsd.edu
Phone: 858-500-2835
Grad Year: 2020

Boiling heat transfer exploits the latent heat of vaporization of a liquid and has been implemented to meet the stringent thermal management requirement of high heat flux electronic devices, many of which need to dissipate heat flux over 1 kW per cm^2. Drawbacks exist in traditional boiling devices: in pool boiling, the critical heat flux (CHF), typically below 200 W/cm^2, is insufficient to meet the demand of high power devices; flow boiling in microchannels could achieve higher heat flux, but are often accompanied with flow instabilities caused temperature and pressure fluctuations, which are detrimental to device performance. In this work, we demonstrate enhanced boiling heat transfer from nanoporous membranes, in which the working mechanism is different from either flow boiling or pool boiling. We achieved a CHF significantly higher than that in pool boiling. Unlike traditional flow boiling in microchannels, liquid flow inside pores was laminar for all working conditions and the wall temperature was stable for the entire range of heat fluxes. Furthermore, by controlling the flow conditions, different heat transfer performance can be tuned. Our study provides a new approach for achieving stable and tunable high heat flux dissipation using boiling heat transfer.

Industry Application Area(s)
Aerospace, Defense, Security | Electronics/Photonics | Energy/Clean technology

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