99. metal-clad semiconductor nanolasers for dense on-chip integration

Department: Electrical & Computer Engineering
Faculty Advisor(s): Y. Shaya Fainman

Primary Student
Name: Suruj Sambhav Deka
Email: sdeka@ucsd.edu
Phone: 202-368-1847
Grad Year: 2021

Future dense integration of on-chip optical components necessitates low power-consuming, small footprint, coherent light sources capable of fast modulation. Usually, attaining an ultra-compact footprint is a challenge since reducing the size of the resonator in all three dimensions to attain subwavelength operation causes the optical mode to spread beyond the physical dimensions of the cavity itself, increasing both the loss and threshold. In metal-clad nanolasers, the metal helps confine the optical mode to the active core while the addition of a dielectric shield in some geometries reduces the mode-metal overlap and thus, the loss. In this work, recent results exploring the viability of dense chip-scale integration of such nanolasers are presented along with ongoing efforts to attain room-temperature, electrically pumped devices as well as nanolasers that can be modulated and/or tuned at high speeds. Additionally, a characterization technique based on the second-order intensity correlation, that can unequivocally establish the coherence of these nano-emitters, is elaborated on.

Industry Application Area(s)
Control Systems | Electronics/Photonics | Semiconductor

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