Faculty Profiles
Shadi A. Dayeh
Professor, Electrical and Computer Engineering
Translational neurotechnology built on semiconductor rigor.
We design human-grade neural interfaces and take them into the operating room, rooted in deep expertise in Si/SiGe and compound semiconductors (InAs, GaAs, GaN, InN) and the hetero-integration science that makes reliable medical hardware possible. Our lab’s platforms include platinum-nanorod (PtNR) electrodes on flexible films, ultra-dense ECoG “PtNRGrids,” flexible stereo-depth arrays, and a Brain-iEEG microdisplay for real-time surgical mapping, used in 100+ patients across three centers and supported by an FDA IDE for a 1,024-channel intraoperative system.
Integrated Electronics & Biointerfaces Lab (IEBL)
IEBL develops end-to-end neuromodulation platforms that connect materials, microfabrication, devices, analytics, and regulated human studies. We pair materials-driven electrodes (low-impedance, high-SNR PtNR interfaces) with manufacturable thin-film processes and clinician-usable visualization, then validate in IDE/IRB-approved settings with partners at UC San Diego Health, MGH, and OHSU. Beyond acute mapping, we advance safety limits for stimulation, and lead multi-site efforts toward wireless, high-channel neural interface systems and vision-system restoration (ARPA-H THEA).
1. Focus areas
- Translational neural interfaces: ultra-dense PtNR surface grids and flexible depth electrodes for human cortex.
- Hetero-integration for medicine: applying Si/SiGe and InGaAs/GaN/InN device know-how to reliable, high-channel medical hardware.
- OR-ready analytics & visualization: Brain-iEEG microdisplay and pipelines that turn dense signals into real-time surgical decisions.
- Safety science & standards: electrochemical/thermal limits quantified in vivo and encoded in multi-site SOPs.
- Clinical translation & scale: FDA IDE intraoperative platform; UG3/UH3 multi-center program on wireless epilepsy systems.
2. Capabilities
- Good manufacturing practice (GMP) cleanroom laboratory for medical device fabrication and assembly, thin-film & micro/nanofabrication (MOCVD, MEMS), device design/verification; electrophysiology from benchtop → large animal → human; modeling/analysis; and regulated human studies in collaboration with leading clinical centers.
Capsule Bio:
Shadi A. Dayeh is Professor of Electrical & Computer Engineering at UC San Diego, with affiliated roles in Chemical and Nano Engineering, Bioengineering, Materials Science & Engineering and Neurological Surgery. He obtained his undergraduate degree in Physics/Electronics at the Lebanese University in Beirut, the MS degree from Southern Methodist University, and the PhD degree from UC San Diego, both in Electrical Engineering. He received the 2026 NANS Innovator Award, NIH Director’s New Innovator Award (2019), ISCS Young Scientist Award (2018), NSF CAREER (2014), Jacobs School Teacher of the Year – ECE (2015), and LebNet Bireme Technologist of the Year (2021). Earlier, he was a Director’s Postdoctoral Fellow and J. R. Oppenheimer Distinguished Fellow at Los Alamos National Laboratory. His group’s work spans PtNR-based, ultra-dense human brain interfaces, flexible depth electrodes, Brain-iEEG visualization, and safety limits for stimulation, culminating in an FDA IDE for a 1,024-channel intraoperative platform and >100 patient uses across three centers. He co-leads a $12.25M NIH UG3/UH3 consortium on high-channel wireless systems and serves as Neuromodulation Architect for ARPA-H Transplantation of Human Eye Allografts.
For prospective students & postdocs
We welcome applicants from ECE, BioE, Materials/Applied Physics, and Neuroscience who want to build devices that reach patients. Projects typically span materials & fabrication, device/ASIC/packaging, rodent and large animal neurophysiology work, signal analysis/ML, and clinical studies with our hospital partners. Expect rigorous mentoring, cross-disciplinary teamwork, and opportunities to publish and translate. Expect a fast-paced, milestone-driven research environment aligned with NIH and ARPA-H cooperative agreements, paired with room to explore bold ideas in next-generation medical implants.
